High-End Lead Free Reflow Oven, SMD Reflow Solder Oven

Product Details
Customization: Available
Metal Coating: Cast Iron (Surface Spray Paint Treatment)
Mode of Production: SMT
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  • High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
  • High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
  • High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
  • High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
  • High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
  • High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
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  • Overview
  • Product Description
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
H1000
Layers
Double-Layer
Base Material
FR-4
Certification
RoHS, CCC, ISO, CE
Customized
Customized
Condition
New
Application Industry
SMT
Warranty
1 Year
After-Sales Service
Online/Onsite
Cargo Transportation Method
Ocean Freight
Transport Package
Vacuum Wooden Box
Specification
80 X 1280 X 1890 mm
Trademark
GDMR
Origin
China
HS Code
8514109000
Production Capacity
200 PCS/Year

Packaging & Delivery

Package Size
5500.00cm * 1700.00cm * 1780.00cm
Package Gross Weight
2500.000kg

Product Description

Product Description
High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
1.Introduce:
GDMR SMT H series high-end reflow oven is a high-performance reflow oven developed for high-end products according to market demand. The main arm of the reflow oven is strengthened to ensure the lateral deformation of the guide rail, and to prevent the board from being stuck or falling. The multi-layer insulation furnace design reduces the surface temperature of the furnace shell by 10 to 20 degrees, effectively reducing the working environment temperature. The double rail structure effectively improves production efficiency, saves energy and production costs. The upper and lower porous rectifier plates inside the furnace are made of 8MM thickened aluminum alloy,The 15% improvement in heat transfer efficiency can easily cope with the lead-free process requirements of more complex and larger welding products. The new cooling structure design allows most of the exhaust gas to be filtered or recycled and returned to the furnace, reducing heat loss and making the flux recovery more thorough.
2.Details:
2-1.Heating system: Micro-circulation technology is used to divide the entire furnace into multiple independent areas. Each air outlet is surrounded by its own return air outlet, which greatly ensures the uniform temperature in the furnace, so that the temperature curve accuracy is very high when the PCB is welded and heated, meeting the high requirements of various products; the upper and lower independent heating modules and independent hot air circulation can skip the problematic temperature zone when problems occur without affecting production. Each temperature zone adopts a modular design, equipped with a high-temperature resistant long-axis hot air motor and a high-heat nickel-chromium heating wire, and it takes less than 20 minutes from room temperature to constant temperature.
High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
High-End Lead Free Reflow Oven, SMD Reflow Solder Oven
2-2 transmission system
The transmission system adopts symmetrical double-groove guide rails, which are resistant to high temperatures and deformation, and absorb little heat. Chain and mesh chain synchronous and equal-speed parallel transportation are standard, and dual-guide rail transportation system or central support system is optional. The width adjustment adopts a three-stage synchronous width adjustment structure, and automatic extension devices for thermal expansion of the guide rails are installed at both ends to effectively ensure the parallelism of the guide rails and prevent the occurrence of board drop and carding. The automatic width adjustment system adopts closed-loop PID control with an accuracy of up to 0.2mm. The equipment is equipped with a computer-controlled automatic refueling system, which can automatically refuel according to the transportation speed and machine status, and the flow rate is adjustable. It has UPS power-off protection function to ensure that the PCB board can be output normally and not damaged after a sudden power outage.
Packaging & Shipping
High-End Lead Free Reflow Oven, SMD Reflow Solder Oven

Standard Wooden Case with Vacuum Package
Shipping Way:
By air, for sample and small package, international express like DHL, UPS, EMS...
By sea, for large package and quantity;
Other ways as customer requested.
Delivery Time:
Within 35 Days.
FAQ
Q: What we can do for you?
A: One-stop SMT Solution Supplier; Reliable SMT Partner

Q: Are you a trade company or manufacturer?
A: Full SMT machines maufacturer for smt line in China; OEM & ODM service are available.

Q: What is your delivery date?
A: About 35 days after receipt of payment.

Q: What is your payment terms?
A: 30% deposit in advance and 70% balance before shipment.

Q: Where do your customers mainly come from?
A:Our customers come from all over the world, currently mainly from Southeast Asia and America.

Q: Why choose you?
A: Professional Supplier ;Professional after-sales service team,Able to provide professional installation training at customer sites.

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